**Tescan Amber X FIB-SEM microscope** A combination of Scanning Electron Microscope (SEM) and Focused Ion Beam microscope (FIB). The configuration in FIB-SEM systems is such that the electron and ion beam focal points coincide, which results in the optimisation of many applications. The use of Xe ions makes the milling much faster then conventional Ga FIBs. Capable of inspecting 200mm wafer, and features: • Oxford Aztec UltiMax 170 EDX elemental analysis system • Oxford Symmetry Electron Backscatter Spectroscopy (EBSD) • Tofwerk Time of Flight Secondary Ion Mass Spectroscopy (ToF-SIMS) **Electron column for UHR imaging** • Analysis mode: SE detector, for topography contrast • UHR-resolution mode: In-beam SE • Backscattered Mode: In-Beam f-BSE, Mid angle BSE • Retractable BSE detector, for wide angle backscattered electrons for material contrast • Retractable HADF STEM (R-STEM) detector: Bright field, Dark field and High Angle Dark Field **Xe ion FIB column** • Aligned at 55 degrees to Electron column • For cross sectioning, 2D/3D patterning, and 3D tomography • Milling rate up to 1000 µm3/s

**Sample Preparation/Inspection Area** **Wild Heerbrugg M3C Stereo Zoom Microscope** The main uses of stereomicroscope is the inspection of samples before further investigation. Specifications: • Low voltage 6V halogen lamp, adjustable brightness, focusing on the luminous area • Magnification ranges from 10x, 16x, 25x and 40x **AGAR Sputter Coater** The Agar sputter coater is used for routine sample coating applications. Simple and economical to operate, the compact bench top unit offer rapid pump down times, fine grain coatings and negligible sample heating. Specifications: • Chamber size: 120mm dia x 120mm high (4.75" x 4.75") • Sputter target: Gold target ø57 x 0.1mm fitted as standard • Optional targets: Au/Pd • Sample table Holds 12 SEM ½” (12.5 mm) stubs • Height adjustment through 60mm

**Tescan Solaris FIB-SEM microscope** A combination of Scanning Electron Microscope (SEM) and Focused Ion Beam microscope (FIB). The configuration in FIB-SEM systems is such that the electron and ion beam focal points coincide, which results in the optimisation of many applications. It enables simultaneous SEM imaging during FIB milling tasks, which is perfect for TEM lamella preparation. Capable of inspecting 200mm wafer and has an Oxford Aztec UltiMax 170 EDX elemental analysis system attached. **Electron column for UHR imaging (immersion lens for non-magnetic samples only)** • Analysis mode: SE detector, for topography contrast • UHR-resolution mode: In-beam SE • Backscattered Mode: In-Beam f-BSE, Mid angle BSE • Retractable BSE detector, for wide angle backscattered electrons for material contrast • Retractable HADF STEM (R-STEM) detector: Bright field, Dark field and High Angle Dark Field • SEM Resolution • 0.6nm @ 30kV, 20kV, and 15kV • 0.7nm @ 10kV • 1.0nm @ 5kV • 1.2nm @ 1kV • 1.7nm @ 500V **Ga ion FIB column** • Aligned at 55 degrees to Electron column • For cross sectioning, 2D/3D patterning, 3D tomography, and TEM lamella preparation

**Carl Zeiss Supra 40 Scanning Electron Microscope (SEM)** A scanning electron microscope (SEM) is a type of electron microscope that produces images of a sample by scanning the surface with a focused beam of electrons. The electrons interact with atoms in the sample, producing various signals that contain information about the surface topography and composition of the sample. **Model_SN** Model: Carl Zeiss Supra 40 **Specifications** High resolution imaging at high and low voltage in high vacuum: 1.3 nm @ 15 kV 2.1 nm @ 1 kV with SE detector, In-lens detector, Backscatter detector and STEM detector STEM mode with BF and HAADF detectors (0.8 nm resolution) Elemental Analysis (EDS): Oxford Instruments X-MAX 50 large area Si diffused detector for high productivity during analysis Sample size up to 45×45mm